• DocumentCode
    871346
  • Title

    Radiation Effects on Oxynitride Gate Dtelectrics

  • Author

    Pancholy, Ranjeet K. ; Erdmann, Frank M.

  • Author_Institution
    Rockwell International Microelectronics Research and Development Center Defense Electronics Operations 3370 Miraloma Avenue Anaheim, CA 92803 714/632-1890
  • Volume
    30
  • Issue
    6
  • fYear
    1983
  • Firstpage
    4141
  • Lastpage
    4145
  • Abstract
    Radiation effects on oxynitrides, SiOxNy, formed by a nitridation anneal of the thermally grown SiO2 layers in an ammonia-nitrogen ambient at lOOO°C are presented. An initial high positive charge trap density of 3 to 6x1011 charges/cm2 and low interface state density 2 to 4×1010 states/eV/cm2 are characteristics of the oxynitride films. The chemical composition using Auger Spectroscopy indicates nitrogen distribution throughout the oxynitride film with higher concentration near the surface and the interface. No mobile-ion contamination or charge injection under high field conditions have been observed. Under radiation, improvement in radiation sensitivity by a factor of 2 to 3 over thermal oxides and no increase in interface state density are shown up to a dose of 1×106 Rad (Si). A model for nitrogen incorporation near the interface satisfying positive charge traps is discussed.
  • Keywords
    Annealing; Chemicals; Circuits; Contamination; Impurities; Interface states; Nitrogen; Plasma temperature; Radiation effects; Silicon;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.1983.4333097
  • Filename
    4333097