DocumentCode
871346
Title
Radiation Effects on Oxynitride Gate Dtelectrics
Author
Pancholy, Ranjeet K. ; Erdmann, Frank M.
Author_Institution
Rockwell International Microelectronics Research and Development Center Defense Electronics Operations 3370 Miraloma Avenue Anaheim, CA 92803 714/632-1890
Volume
30
Issue
6
fYear
1983
Firstpage
4141
Lastpage
4145
Abstract
Radiation effects on oxynitrides, SiOxNy, formed by a nitridation anneal of the thermally grown SiO2 layers in an ammonia-nitrogen ambient at lOOO°C are presented. An initial high positive charge trap density of 3 to 6x1011 charges/cm2 and low interface state density 2 to 4Ã1010 states/eV/cm2 are characteristics of the oxynitride films. The chemical composition using Auger Spectroscopy indicates nitrogen distribution throughout the oxynitride film with higher concentration near the surface and the interface. No mobile-ion contamination or charge injection under high field conditions have been observed. Under radiation, improvement in radiation sensitivity by a factor of 2 to 3 over thermal oxides and no increase in interface state density are shown up to a dose of 1Ã106 Rad (Si). A model for nitrogen incorporation near the interface satisfying positive charge traps is discussed.
Keywords
Annealing; Chemicals; Circuits; Contamination; Impurities; Interface states; Nitrogen; Plasma temperature; Radiation effects; Silicon;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.1983.4333097
Filename
4333097
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