• DocumentCode
    871780
  • Title

    Silicon-on-Sapphire Complementary MOS Memory Cells

  • Author

    Allison, James F. ; Heiman, Frederic P. ; Burns, Joseph R.

  • Volume
    2
  • Issue
    4
  • fYear
    1967
  • fDate
    12/1/1967 12:00:00 AM
  • Firstpage
    208
  • Lastpage
    212
  • Abstract
    Complementary MOS circuitry offers the advantages of high-speed, low-quiescent power dissipation, and loose device parameter tolerances. However, only with the recent development of clean technology has it been possible to fabricate stable devices. The advances in silicon-on-sapphire epitaxy have permitted the development of a high-speed low-power complementary MOS circuit module. This paper describes the circuit, its operation, the method used in fabricating it in silicon-on-sapphire, and the switching performance of the circuit. The basic memory cell is a NDRO flip-flop with feedback supplied through a transmission gate. The total circuit delay from write command to output sense signal is 5 to 7 ns at a standby power dissipation of 7 to 20 μ W. To show the feasibility of adapting silicon-on-sapphire complementary MOS technology to LSI, a 9-bit word (1-byte) was constructed. The entire module containing 54 N-channel and 36 P-channel devices dissipated less than 100 μ W in a standby condition.
  • Keywords
    Complementary circuits; Large-scale integration; MOS integrated circuits; Memory architecture; Silicon materials/devices; Conductive films; Delay estimation; Large scale integration; Microwave theory and techniques; Power dissipation; Semiconductor films; Silicon; Strips; Substrates; Switching circuits;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.1967.1049820
  • Filename
    1049820