Circuit models for constant impedance micromachined lines on dielectric transitions

Author

Banerjee, S. Riki ; Drayton, Rhonda Franklin

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Minnesota, Minneapolis, MN, USA

Volume

52

Issue

1

fYear

2004

Firstpage

105

Lastpage

111

Abstract

Constant impedance microstrip lines printed across nonuniform thickness substrates are studied. Accurate LC models are described to predict the discontinuity effect for dielectric step changes greater than 200 μm at the boundary interface. A variety of step or taper transition combinations in the conductor and dielectric are considered. When compared to full-wave simulations, the successfully modeled designs have return and insertion losses within 3 and 0.33 dB, respectively.

Keywords

dielectric losses; finite element analysis; micromechanical devices; microstrip discontinuities; microstrip transitions; FEM field solver; LC models; bandwidth performance; boundary interface; circuit models; constant impedance micromachined lines; dielectric step changes; dielectric transitions; discontinuity effect; insertion losses; interconnect behavior; microstrip lines; nonuniform thickness substrates; return losses; step transition; taper transition; Conductors; Dielectric substrates; Impedance; Integrated circuit interconnections; Integrated circuit technology; Micromachining; Microstrip; Radio frequency; Semiconductor device modeling; Silicon;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.2003.921253

Filename

1262681