• DocumentCode
    874444
  • Title

    In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing

  • Author

    Davis, Cleon E. ; Dickherber, Anthony J. ; Hunt, William D. ; May, Gary S.

  • Author_Institution
    Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD
  • Volume
    31
  • Issue
    4
  • fYear
    2008
  • Firstpage
    273
  • Lastpage
    284
  • Abstract
    Variable-frequency microwave (VFM) curing can perform the same processing steps as conventional thermal processing in minutes, without compromising intrinsic material properties. With increasing demand for novel dielectrics, there is a corresponding demand for new processing techniques that lead to comparable or better properties than conventional methods. VFM processing can be a viable alternative to conventional thermal techniques. However, current limitations include a lack of reliable temperature measuring techniques. This research focuses on developing a reliable temperature measuring system using acoustic techniques to monitor low-k polymer dielectrics cured on silicon wafers in a VFM furnace. The acoustic sensor exhibits the capability to measure temperatures from 20degC to 300degC with an attainable accuracy of plusmn2 degrees.
  • Keywords
    acoustic transducers; curing; temperature measurement; acoustic temperature measurement; low-k polymer dielectrics; silicon wafers; thermal processing; variable-frequency microwave curing; Acoustic measurements; Curing; Current measurement; Dielectric measurements; Material properties; Monitoring; Polymers; Silicon; Temperature measurement; Temperature sensors; Acoustic temperature sensing; polymer curing; rapid curing; variable frequency microwave curing; zinc oxide deposition;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2008.2004570
  • Filename
    4634592