DocumentCode :
875600
Title :
EIC Volunteer Profile
Volume :
24
Issue :
5
fYear :
2008
Firstpage :
37
Lastpage :
37
Abstract :
Howard attended his first EIC meeting in Chicago in 1987 and has been involved with the conference since then, either by writing and presenting papers or as a volunteer. In 1989 he won the Best Paper Award and was the Technical Co-Chair in 2001 and 2003.
fLanguage :
English
Journal_Title :
Electrical Insulation Magazine, IEEE
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.2008.4635661
Filename :
4635661
Link To Document :
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