• DocumentCode
    875600
  • Title

    EIC Volunteer Profile

  • Volume
    24
  • Issue
    5
  • fYear
    2008
  • Firstpage
    37
  • Lastpage
    37
  • Abstract
    Howard attended his first EIC meeting in Chicago in 1987 and has been involved with the conference since then, either by writing and presenting papers or as a volunteer. In 1989 he won the Best Paper Award and was the Technical Co-Chair in 2001 and 2003.
  • fLanguage
    English
  • Journal_Title
    Electrical Insulation Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    0883-7554
  • Type

    jour

  • DOI
    10.1109/MEI.2008.4635661
  • Filename
    4635661
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=875600