Title :
New interconnection technology for enhanced module efficiency
Author :
Schmidt, W. ; Rasch, K.D.
Author_Institution :
Telefunken Systemtech. GmbH, Heinbronn, West Germany
fDate :
2/1/1990 12:00:00 AM
Abstract :
In order to enhance solar modular efficiency, an innovative interconnection method for solar cells has been developed. The solar cells are two-dimensionally interconnected to a large-area, shingle-roof patterned solar cell array. Test samples were fabricated using silicon solar cells with conventional cell structures. Packing densities over 96% and module efficiencies of 17.3% and 13.4% (AM 1.5, 100 mW/cm2 ) were obtained for single-crystalline and polycrystalline silicon solar cells, respectively
Keywords :
elemental semiconductors; packaging; silicon; solar cell arrays; solar cells; 13.4 percent; 17.3 percent; Si; interconnection technology; module efficiencies; packing density; polycrystalline solar cells; shingle roof pattern; single crystal solar cells; solar cell array; solar cells; two-dimensionally interconnected; Absorption; Building integrated photovoltaics; Electric resistance; Fabrication; Optical interconnections; Optical losses; Optical reflection; Photovoltaic cells; Silicon; Testing;
Journal_Title :
Electron Devices, IEEE Transactions on
