DocumentCode :
875981
Title :
Thermocompression bond tester
Author :
Wasson, R.D.
Volume :
53
Issue :
11
fYear :
1965
Firstpage :
1736
Lastpage :
1737
Keywords :
Bonding forces; Fixtures; Force measurement; Metallization; Metals industry; Micromanipulators; Power system reliability; Probes; Testing; Wire;
fLanguage :
English
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/PROC.1965.4353
Filename :
1446283
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=875981