Nondestructive analysis of interconnection in two-die BGA using TDR

Author

Chen, Ming-Kun ; Tai, Cheng-Chi ; Huang, Yu-Jung

Author_Institution

Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan

Volume

55

Issue

2

fYear

2006

fDate

4/1/2006 12:00:00 AM

Firstpage

400

Lastpage

405

Abstract

Nondestructive analysis (NDA) is one of the most important tasks that is performed during the industrial characterization of integrated circuits (ICs) because even a tiny defect or failure in the IC packages could be disastrous from the standpoint of quality control. To detect an interconnection failure in IC packages, a time-domain reflectometry (TDR) analysis system was developed. An open-end fixture (OEF) was employed to detect the rapid rise of edge signals from the package and to monitor them under the two parameters of time interval and reflection voltage. We developed a simple and effective electrical NDA system based on the TDR technology that can evaluate the interconnection of ball grid array (BGA) packages. The TDR-measurement results can determine both the failure location and type based on the aforementioned parameters for a two-die BGA package.

Keywords

ball grid arrays; failure analysis; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; nondestructive testing; time-domain reflectometry; ball grid array packages; failure location; industrial characterization; integrated circuit packages; interconnection failure; nondestructive analysis; open-end fixture; quality control; time-domain reflectometry analysis system; Electrical equipment industry; Failure analysis; Fixtures; Industrial control; Integrated circuit interconnections; Integrated circuit packaging; Performance analysis; Quality control; Reflectometry; Time domain analysis; Ball grid array (BGA); failure location; nondestructive analysis (NDA); open defect; open-end fixture (OEF); short defect; time-domain reflectometry (TDR);

fLanguage

English

Journal_Title

Instrumentation and Measurement, IEEE Transactions on

Publisher

ieee

ISSN

0018-9456

Type

jour

DOI

10.1109/TIM.2006.870318

Filename

1608581