Overlay high-density interconnect: a chips-first multichip module technology

Author

Daum, Wolfgang ; Burdick, William E., Jr. ; Fillion, Raymond A.

Author_Institution

GE Corporate Res. & Dev. Center, Schenectady, NY, USA

Volume

26

Issue

4

fYear

1993

fDate

4/1/1993 12:00:00 AM

Firstpage

23

Lastpage

29

Abstract

A high-density interconnection (HDI) technology that involves placing bare chips into cavities on a base substrate and fabricating the thin-film interconnect structure on top of the components is described. The interconnects to the chip I/O pads are formed as part of the thin-film fabrication process, thus eliminating the need for wire bonds, tape-automated bonds (TABs), or solder bumps. The need for advanced packaging and interconnection and the standard chips-last multichip module (MCM) technologies are reviewed. The HDI chips-first MCM technology´s IC pretest requirements and approaches, substrate and packaged parts test, and substrate packaging are discussed.<>

Keywords

multichip modules; thin film devices; bare chips; base substrate; cavities; chips-first multichip module technology; high-density interconnection; packaged parts test; packaging; thin-film fabrication; thin-film interconnect structure; Clocks; Delay; Electronic packaging thermal management; Integrated circuit interconnections; Multichip modules; Nonhomogeneous media; Polymer films; Research and development; Silicon; Substrates;

fLanguage

English

Journal_Title

Computer

Publisher

ieee

ISSN

0018-9162

Type

jour

DOI

10.1109/2.206510

Filename

206510