Title :
Overlay high-density interconnect: a chips-first multichip module technology
Author :
Daum, Wolfgang ; Burdick, William E., Jr. ; Fillion, Raymond A.
Author_Institution :
GE Corporate Res. & Dev. Center, Schenectady, NY, USA
fDate :
4/1/1993 12:00:00 AM
Abstract :
A high-density interconnection (HDI) technology that involves placing bare chips into cavities on a base substrate and fabricating the thin-film interconnect structure on top of the components is described. The interconnects to the chip I/O pads are formed as part of the thin-film fabrication process, thus eliminating the need for wire bonds, tape-automated bonds (TABs), or solder bumps. The need for advanced packaging and interconnection and the standard chips-last multichip module (MCM) technologies are reviewed. The HDI chips-first MCM technology´s IC pretest requirements and approaches, substrate and packaged parts test, and substrate packaging are discussed.<>
Keywords :
multichip modules; thin film devices; bare chips; base substrate; cavities; chips-first multichip module technology; high-density interconnection; packaged parts test; packaging; thin-film fabrication; thin-film interconnect structure; Clocks; Delay; Electronic packaging thermal management; Integrated circuit interconnections; Multichip modules; Nonhomogeneous media; Polymer films; Research and development; Silicon; Substrates;
