Title :
A multichip module design process for notebook computers
Author :
Franzon, Paul D. ; Evans, Robert J.
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
fDate :
4/1/1993 12:00:00 AM
Abstract :
A packaging system design process for multichip modules (MCMs) is presented. The performance factors, cost factors, alternative packaging technologies, and packaging alternatives for daughter cards are discussed. The process is illustrated by applying to the design of a 80386SL chip that contains a 32-b integer central processing unit (CPU), memory management, bus control, and buffering, and a 82360SL companion chip that contains control functions for the system, I/O, peripherals, power management, and a majority of the glue logic required by the system.<>
Keywords :
microprocessor chips; multichip modules; 32-b integer central processing unit; 80386SL chip; buffering; bus control; cost factors; glue logic; memory management; multichip module design process; notebook computers; packaging system design process; performance factors; Central Processing Unit; Centralized control; Control systems; Costs; Energy management; Memory management; Multichip modules; Packaging; Power system management; Process design;
