Design for packageability-early consideration of packaging from a VLSI designer´s viewpoint

Author

Dehkordi, Peyman H. ; Bouldin, Donald W.

Author_Institution

Dept. of Electr. & Comput. Eng., Tennessee Univ., Knoxville, TN, USA

Volume

26

Issue

4

fYear

1993

fDate

4/1/1993 12:00:00 AM

Firstpage

76

Lastpage

81

Abstract

Designing VLSI dies without considering packaging issues may result in a suboptimum system. It is argued that before the design of VLSI dies is completed, packaging issues should be evaluated, since they may affect choices in VLSI circuit design and layout. To illustrate this, the design of an image processing chip-set of three integrated circuits for wire-bond printed circuit board (PCB) and flip-chip multichip module deposited (MCM-D) technologies is reviewed. It is shown that the characteristics of these chips vary, since they are designed with different packaging in mind.<>

Keywords

VLSI; flip-chip devices; integrated circuit technology; lead bonding; multichip modules; VLSI; circuit design and layout; design for packageability; dies; flip-chip multichip module; image processing chip-set; packaging; wire-bond printed circuit board; Added delay; Delay lines; Integrated circuit packaging; Integrated circuit technology; Performance evaluation; Performance gain; Pins; Printed circuits; System performance; Very large scale integration;

fLanguage

English

Journal_Title

Computer

Publisher

ieee

ISSN

0018-9162

Type

jour

DOI

10.1109/2.206519

Filename

206519