DocumentCode
877125
Title
Yield-enhancement techniques in semiconductor memory
Author
Sander, Wendell B.
Volume
7
Issue
4
fYear
1972
Firstpage
298
Lastpage
300
Abstract
In manufacturing semiconductor memory devices a significant number of die have only a few defects. These defective parts can be used in memory-system manufacture by designing boards with part positions that can accept defective parts. These partially good parts are then categorized to match the board location. Such systems have been built using both conventional printed-circuit boards and multichip hybrid assembly.
Keywords
Semiconductor storage devices; semiconductor storage devices; Assembly systems; Bonding; Decoding; Integrated circuit packaging; Isolation technology; Preamplifiers; Semiconductor device manufacture; Semiconductor memory; Wiring; Yield estimation;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1972.1050303
Filename
1050303
Link To Document