Title :
Conceptual Topology for the Integration of Planar and Quasi 3D Antennas in Chip Packages
Author :
Vandenbosch, Guy A E ; Mestdagh, Steven
Author_Institution :
Dept. of Electr. Eng., Katholieke Univ. Leuven, Leuven
Abstract :
A conceptual topology for the integration of antennas in chip packages is proposed. First, the complete topology is presented and discussed. Then, a full antenna design is described, including fabrication and measurement of a scale model of the basic radiating structure. Finally, a numerical study of the shielding capabilities of the conceptual structure is given.
Keywords :
antenna radiation patterns; chip scale packaging; electromagnetic shielding; planar antennas; antenna design; chip packages; conceptual topology; planar antennas; quasi 3D antennas; radiating structure; scale model fabrication; Antenna accessories; Bandwidth; Costs; Integrated circuit interconnections; Integrated circuit packaging; Microstrip antennas; Millimeter wave integrated circuits; Millimeter wave technology; Resonant frequency; Topology; Chip packaging; integrated antennas; shielding; small antennas;
Journal_Title :
Antennas and Propagation, IEEE Transactions on
DOI :
10.1109/TAP.2008.929456
