Silver-induced volatile species generation from conductive die attach adhesives

Author

Phillips, Terry E. ; Dehaas, Newman ; Goodwin, Phillip G. ; Benson, Richard C.

Author_Institution

Appl. Phys. Lab., John Hopkins Univ., Laurel, MD, USA

Volume

15

Issue

6

fYear

1992

fDate

12/1/1992 12:00:00 AM

Firstpage

956

Lastpage

963

Abstract

Commercial and model epoxy die-attach adhesives, with and without silver filler, were investigated to examine the effect the silver filler has on the outgassing characteristics of the organic matrix. The materials were subjected to typical temperature processing schedules including cure, preseal bake, and burn-in. The volatile species outgassing during each of the processing periods were analyzed by gas chromatography/mass spectrometry. Thermogravimetric and calorimetric analyses were also performed. It was determined that silver in the adhesive leads to a greater mass loss and a marked change in the outgassing species relative to the same adhesive system without silver

Keywords

chromatography; conducting polymers; filled polymers; mass spectroscopic chemical analysis; microassembling; silver; thermal analysis; Ag filler; Ag induced volatile species generation; GC/MS; TGA; burn-in; calorimetric analyses; conductive die attach adhesives; cure; epoxy die-attach adhesives; gas chromatography/mass spectrometry; organic matrix; outgassing characteristics; outgassing species; preseal bake; temperature processing schedules; thermogravimetric analysis; volatile species outgassing; Chemicals; Coatings; Conducting materials; Conductivity; Curing; Microassembly; Polyimides; Polymers; Silver; Temperature;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.206917

Filename

206917