Reliability modeling of soldered interconnections

Author

Prosser, James F. ; Panousis, Nicholas T.

Author_Institution

IBM Corp., San Jose, CA, USA

Volume

15

Issue

6

fYear

1992

fDate

12/1/1992 12:00:00 AM

Firstpage

1046

Lastpage

1050

Abstract

The results of work to determine the minimum solder height that would produce a satisfactory joint in an electronic assembly used in IBM disk drives is described. Solder pads with heights ranging from 20 to 160 μm were produced by varying the solder deposition process. After joints were made using the standard soldering process, the joint strengths were measured by pulling the wire at an angle of 45° and measuring the force required to either break the wire (wire breaks) or pull the wire out of the solder (wire peels). A figure of merit for the solder process is defined as the fraction of wire peels. A generalized regression model is used to correlate this figure of merit with the solder height. This allows interpolation of the data, calculation of confidence intervals, and a check of the validity of process control plans. The model is used to determine the minimum solder height, and to establish a sampling plan to monitor production

Keywords

electronic equipment manufacture; process control; quality control; reliability; soldering; IBM disk drives; confidence intervals; electronic assembly; figure of merit; fraction of wire peels; generalized regression model; joint strengths; minimum solder height; process control plans; production monitoring; pull tests; reliability modeling; sampling plan; solder deposition process; solder process; soldered interconnections; standard soldering process; Assembly; Disk drives; Force measurement; Interpolation; Measurement standards; Monitoring; Process control; Sampling methods; Soldering; Wire;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.206929

Filename

206929