New analytical study for popcorn phenomenon [package cracking]

Author

Kimura, Hideto ; Yoshida, Tsukasa ; Ohizumi, Shin Ichi ; Nishioka, Tsutomu ; Nakao, Minoru ; Harada, Masatomi

Author_Institution

Nitto Denko Corp., Mie, Japan

Volume

15

Issue

6

fYear

1992

fDate

12/1/1992 12:00:00 AM

Firstpage

1117

Lastpage

1122

Abstract

Package cracking during soldering is considered. This cracking is classified by two mechanisms. One mechanism is a classical MODE-I, whereby delamination originates under the die pad and propagates in most cases to the package´s outer surface. The other is MODE-II cracking which starts from delamination at the die attach material interface. A simulated method of MODE-II cracking is established. Using this method, suitable properties of encapsulant to prevent MODE-II cracking are presented. These properties led to the development of a new molding compound, which has excellent resistance to MODE-II cracking

Keywords

failure analysis; moisture; packaging; printed circuit manufacture; reliability; soldering; surface mount technology; MODE-I cracking; MODE-II cracking; analytical study; delamination; encapsulant properties; mechanisms; moisture vaporization; molding compound; package cracking during soldering; popcorn phenomenon; simulated method; Absorption; Delamination; Electronics packaging; Flowcharts; Moisture; Silver; Soldering; Stress; Surface cracks; Temperature;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.206938

Filename

206938