DocumentCode :
877921
Title :
Charge transfer in overlapping gate charge-coupled devices
Author :
Mohsen, Amr M. ; McGill, T.C. ; Mead, Carver A.
Volume :
8
Issue :
3
fYear :
1973
fDate :
6/1/1973 12:00:00 AM
Firstpage :
191
Lastpage :
207
Abstract :
A detailed numerical simulation of the free charge transfer in overlapped gate charge-coupled devices is presented. The transport are analyzed in terms of thermal diffusion, self-induced fields, and fringing fields under all the relevant electrodes and interelectrode regions with time-varying gate potentials. The results of the charge transfer with different clocking schemes and clocking waveforms are presented. The dependence of the stages of the charge transfer on the device parameters are discussed in detail. A lumped-circuit model of CCD that could be used to obtain the charge-transfer characteristics with various clocking waveforms is also presented.
Keywords :
Metal-insulator-semiconductor devices; Semiconductor device models; Simulation; metal-insulator-semiconductor devices; semiconductor device models; simulation; Charge coupled devices; Charge transfer; Clocks; Electrodes; Helium; Large-scale systems; Metallization; Numerical simulation; Surface contamination; Thickness control;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.1973.1050376
Filename :
1050376
Link To Document :
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