Trends in low-cost, high-performance substrate technology

Author

Carey, David H.

Author_Institution

Microelectronics & Computer Technology Corp., Austin, TX, USA

Volume

13

Issue

2

fYear

1993

fDate

4/1/1993 12:00:00 AM

Firstpage

19

Lastpage

27

Abstract

The trends in high density interconnection (HDI) multichip module (MCM) techniques that have the potential to reduce interconnection cost and production time are described. The implementation in laminated dielectric (MCM-L) technology of a workstation processor core illustrates current substrate technology capabilities. The design, routing, layout and thermal management of the processor core are described. Thin-film deposited dielectric (MCM-D) technology is discussed as a cost-effective method for future interconnection applications.<>

Keywords

circuit layout; integrated circuit technology; multichip modules; substrates; thin film devices; design; high density interconnection; interconnection cost; laminated dielectric; layout; multichip module; production time; routing; substrate technology; thermal management; thin film deposited dielectric technology; workstation processor core; Ceramics; Costs; Dielectric substrates; Integrated circuit interconnections; Laminates; Microelectronics; Multichip modules; Packaging; Transistors; Wiring;

fLanguage

English

Journal_Title

Micro, IEEE

Publisher

ieee

ISSN

0272-1732

Type

jour

DOI

10.1109/40.207085

Filename

207085