Title :
Trends in low-cost, high-performance substrate technology
Author_Institution :
Microelectronics & Computer Technology Corp., Austin, TX, USA
fDate :
4/1/1993 12:00:00 AM
Abstract :
The trends in high density interconnection (HDI) multichip module (MCM) techniques that have the potential to reduce interconnection cost and production time are described. The implementation in laminated dielectric (MCM-L) technology of a workstation processor core illustrates current substrate technology capabilities. The design, routing, layout and thermal management of the processor core are described. Thin-film deposited dielectric (MCM-D) technology is discussed as a cost-effective method for future interconnection applications.<>
Keywords :
circuit layout; integrated circuit technology; multichip modules; substrates; thin film devices; design; high density interconnection; interconnection cost; laminated dielectric; layout; multichip module; production time; routing; substrate technology; thermal management; thin film deposited dielectric technology; workstation processor core; Ceramics; Costs; Dielectric substrates; Integrated circuit interconnections; Laminates; Microelectronics; Multichip modules; Packaging; Transistors; Wiring;
Journal_Title :
Micro, IEEE
