DocumentCode
878186
Title
Interaction of multichip module substrates with high-density connectors
Author
Belopolsky, Yakov
Author_Institution
Berg Electronics, Etters, PA, USA
Volume
13
Issue
2
fYear
1993
fDate
4/1/1993 12:00:00 AM
Firstpage
36
Lastpage
44
Abstract
The stresses and strains in substrate-connector systems in multichip modules (MCMs) are discussed. Simultaneous stresses were applied as structural loads in combined stress models. Modeling results show that definite relations exist between connector pitch, length, substrate thickness and material, and stresses in a connector body.<>
Keywords
multichip modules; substrates; connector pitch; high-density connectors; multichip module substrates interaction; structural loads; substrate thickness; substrate-connector systems; Connectors; Costs; Multichip modules; Nonhomogeneous media; Silicon on insulator technology; Space technology; Temperature; Thermal expansion; Thermal force; Thermal stresses;
fLanguage
English
Journal_Title
Micro, IEEE
Publisher
ieee
ISSN
0272-1732
Type
jour
DOI
10.1109/40.207087
Filename
207087
Link To Document