Amalgams for improved electronics interconnection

Author

Mackay, Colin A.

Author_Institution

Microelectronics & Computer Technol. Corp., Austin, TX, USA

Volume

13

Issue

2

fYear

1993

fDate

4/1/1993 12:00:00 AM

Firstpage

46

Lastpage

58

Abstract

The characteristics, advantages, and potential applications of amalgam systems, which offer a promising alternative to traditional electronics solders for lower temperature (and hence lower cost) processes and components, without the environmental drawbacks of most solder systems, are described. Amalgams are nonequilibrium, mechanically alloyed materials formed at or near room temperature between a liquid metal and a powder. They offer exceptional thermal stability and superior joint strength and thermal cycle measurements. Gallium/nickel, gallium/copper, and gallium/copper/nickel amalgam alloys are discussed. The amalgamation methods, requirements for electronics amalgams, amalgam hardening mechanism, and amalgam wetting techniques are also discussed. Applications of amalgams to large die area attachments and flip chips are described.<>

Keywords

flip-chip devices; packaging; GaCu; GaNi; amalgam hardening; amalgam systems; amalgam wetting techniques; die area attachments; electronics interconnection; flip chips; joint strength; mechanically alloyed materials; solder systems; thermal cycle measurements; thermal stability; Copper alloys; Costs; Flip chip; Gallium alloys; Inorganic materials; Nickel alloys; Powders; Semiconductor device measurement; Temperature; Thermal stability;

fLanguage

English

Journal_Title

Micro, IEEE

Publisher

ieee

ISSN

0272-1732

Type

jour

DOI

10.1109/40.207088

Filename

207088