• DocumentCode
    8782
  • Title

    Processor Tile Shapes and Interconnect Topologies for Dense On-Chip Networks

  • Author

    Zhibin Xiao ; Baas, Bevan M.

  • Author_Institution
    Oracle America Inc., Santa Clara, CA, USA
  • Volume
    22
  • Issue
    6
  • fYear
    2014
  • fDate
    Jun-14
  • Firstpage
    1377
  • Lastpage
    1390
  • Abstract
    We propose two eight-neighbor, two five-nearest-neighbor, and three six-nearest-neighbor interconnection topologies for many-core processor arrays-three of which use five-sided or hexagonal processor tiles-which typically reduce application communication distance and result in an overall application processor that requires fewer cores and lower power consumption. A 16-bit processor with the appropriate number of input and output ports is implemented in all topologies and tile shapes. The hexagonal and five-sided processor tiles and arrays of tiles are laid out with industry standard automatic place and route design flow and Manhattan-style wires without full-custom layout. A 1080p H.264/AVC residual video encoder and a 54 Mb/s 802.11a/g OFDM wireless local area network baseband receiver are mapped onto all topologies. The six-neighbor hexagonal tile incurs a 2.9% area increase per tile compared with the four-neighbor 2-D mesh, but its much more effective interprocessor interconnect yields an average total application area reduction of 22% and an average application power savings of 17%.
  • Keywords
    integrated circuit design; low-power electronics; multiprocessor interconnection networks; network routing; network-on-chip; power consumption; radio receivers; video codecs; wireless LAN; 2D mesh; 802.11a/g OFDM wireless local area network baseband receiver; H.264/AVC residual video encoder; Manhattan-style wires; bit rate 54 Mbit/s; communication distance; dense on-chip networks; five-sided processor tiles; hexagonal processor tiles; interconnect topologies; interprocessor interconnect; many-core processor arrays; nearest-neighbor interconnection topologies; power consumption; power savings; processor tile shapes; route design flow; storage capacity 16 bit; CMOS digital integrated circuits; digital signal processing (DSP); hexagonal processor; interconnection topology; many-core processor; multimedia; network on chip (NoC); network on chip (NoC).;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2013.2265937
  • Filename
    6547182