DocumentCode :
8782
Title :
Processor Tile Shapes and Interconnect Topologies for Dense On-Chip Networks
Author :
Zhibin Xiao ; Baas, Bevan M.
Author_Institution :
Oracle America Inc., Santa Clara, CA, USA
Volume :
22
Issue :
6
fYear :
2014
fDate :
Jun-14
Firstpage :
1377
Lastpage :
1390
Abstract :
We propose two eight-neighbor, two five-nearest-neighbor, and three six-nearest-neighbor interconnection topologies for many-core processor arrays-three of which use five-sided or hexagonal processor tiles-which typically reduce application communication distance and result in an overall application processor that requires fewer cores and lower power consumption. A 16-bit processor with the appropriate number of input and output ports is implemented in all topologies and tile shapes. The hexagonal and five-sided processor tiles and arrays of tiles are laid out with industry standard automatic place and route design flow and Manhattan-style wires without full-custom layout. A 1080p H.264/AVC residual video encoder and a 54 Mb/s 802.11a/g OFDM wireless local area network baseband receiver are mapped onto all topologies. The six-neighbor hexagonal tile incurs a 2.9% area increase per tile compared with the four-neighbor 2-D mesh, but its much more effective interprocessor interconnect yields an average total application area reduction of 22% and an average application power savings of 17%.
Keywords :
integrated circuit design; low-power electronics; multiprocessor interconnection networks; network routing; network-on-chip; power consumption; radio receivers; video codecs; wireless LAN; 2D mesh; 802.11a/g OFDM wireless local area network baseband receiver; H.264/AVC residual video encoder; Manhattan-style wires; bit rate 54 Mbit/s; communication distance; dense on-chip networks; five-sided processor tiles; hexagonal processor tiles; interconnect topologies; interprocessor interconnect; many-core processor arrays; nearest-neighbor interconnection topologies; power consumption; power savings; processor tile shapes; route design flow; storage capacity 16 bit; CMOS digital integrated circuits; digital signal processing (DSP); hexagonal processor; interconnection topology; many-core processor; multimedia; network on chip (NoC); network on chip (NoC).;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2013.2265937
Filename :
6547182
Link To Document :
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