• DocumentCode
    878255
  • Title

    Photonic A/D conversion using low-temperature-grown GaAs MSM switches integrated with Si-CMOS

  • Author

    Urata, Ryohei ; Nathawad, Lalitkumar Y. ; Takahashi, Ryo ; Ma, Kai ; Miller, David A B ; Wooley, Bruce A. ; Harris, James S., Jr.

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ., CA, USA
  • Volume
    21
  • Issue
    12
  • fYear
    2003
  • Firstpage
    3104
  • Lastpage
    3115
  • Abstract
    By linking the unique capabilities of photonic devices with the signal processing power of electronics, photonically sampled analog-to-digital (A/D) conversion systems have demonstrated the potential for superior performance over all-electrical A/D conversion systems. We adopt a photonic A/D conversion scheme using low-temperature (LT)-grown GaAs metal-semiconductor-metal (MSM) photoconductive switches integrated with Si-CMOS A/D converters. The large bandwidth of the LT GaAs switches and the low timing jitter and short width of mode-locked laser pulses are combined to accurately sample input frequencies up to several tens of gigahertz. CMOS A/D converters perform back-end digitization, and time-interleaving is used to increase the total sampling rate of the system. In this paper, we outline the development of this system, from optimization of the LT GaAs material, speed and responsivity measurements of the switches, bandwidth and linearity characterization of the first-stage optoelectronic sample-and-hold, to integration of the switches with CMOS chips. As a final proof-of-principle demonstration, a two-channel system was fabricated with LT GaAs MSM switches flip-chip bonded to CMOS A/D converters. When operated at an aggregate sampling rate of 160 megasamples/s, the prototype system exhibits ∼3.5 effective number of bits (ENOB) of resolution for input signals up to 40 GHz.
  • Keywords
    CMOS analogue integrated circuits; III-V semiconductors; analogue-digital conversion; elemental semiconductors; flip-chip devices; gallium arsenide; integrated optoelectronics; metal-semiconductor-metal structures; microwave photonics; photoconducting switches; sample and hold circuits; signal sampling; silicon; timing jitter; CMOS chips; GaAs; LT GaAs material optimization; Si; Si-CMOS A/D converters; back-end digitization; first-stage optoelectronic sample-and-hold circuits; flip-chip bonding; integrated optoelectronics; low timing jitter; low-temperature-grown GaAs MSM switches; metal-semiconductor-metal photoconductive switches; mode-locked laser pulses; photonic A/D conversion; photonic devices; photonically sampled analog-to-digital conversion; signal processing; time interleaving; two-channel system; Bandwidth; Gallium arsenide; Joining processes; Laser mode locking; Photoconducting materials; Sampling methods; Signal processing; Switches; Switching converters; Timing jitter;
  • fLanguage
    English
  • Journal_Title
    Lightwave Technology, Journal of
  • Publisher
    ieee
  • ISSN
    0733-8724
  • Type

    jour

  • DOI
    10.1109/JLT.2003.820054
  • Filename
    1263728