DocumentCode :
878403
Title :
Scan-Architecture-Based Evaluation Technique of SET and SEU Soft-Error Rates at Each Flip-Flop in Logic VLSI Systems
Author :
Yanagawa, Yoshimitsu ; Kobayashi, Daisuke ; Ikeda, Hirokazu ; Saito, Hirobumi ; Hirose, Kazuyuki
Author_Institution :
Dept. of Electron. Eng., Univ. of Tokyo, Tokyo
Volume :
55
Issue :
4
fYear :
2008
Firstpage :
1947
Lastpage :
1952
Abstract :
A scan flip-flop (FF) is designed to observe both single event transient (SET) and single event upset (SEU) soft errors in logic VLSI systems. The SET and SEU soft errors mean the upset caused by latching an SET pulse that originates in combinational logic blocks and the upset caused by a direct ion hit to the FF, respectively. An irradiation test method using the scan FF is proposed to obtain SET and SEU soft-error rates at each FF distributed in logic VLSI systems. A test chip is designed using a 0.2-mum fully-depleted silicon-on-insulator standard cell library. The basic concepts have been validated with Verilog timing simulations. The cell-level implementation costs of the proposed scan FF are estimated to be reasonable.
Keywords :
VLSI; combinational circuits; errors; flip-flops; hardware description languages; integrated circuit design; integrated circuit testing; integrated logic circuits; radiation effects; timing; SET error rate; SEU soft error rate; Verilog timing simulation; combinational logic blocks; flip-flop device; fully-depleted silicon-on-insulator standard cell library; irradiation test method; logic VLSI system; scan-architecture-based evaluation method; single event transient soft errors; single event upset soft errors; size 0.2 micron; test chip; Flip-flops; Hardware design languages; Libraries; Logic design; Logic testing; Silicon on insulator technology; Single event upset; System testing; Timing; Very large scale integration; Integrated circuit radiation effects; irradiation test; logic VLSI system; scan architecture; single event transient; single event upset;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2008.2000772
Filename :
4636968
Link To Document :
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