• DocumentCode
    87918
  • Title

    High-Performance SLS Nanowire TFTs With Dual-Gate Structure

  • Author

    Tsung-Kuei Kang

  • Author_Institution
    Dept. of Electron. Eng., Feng-Chia Univ., Taichung, Taiwan
  • Volume
    60
  • Issue
    7
  • fYear
    2013
  • fDate
    Jul-13
  • Firstpage
    2276
  • Lastpage
    2281
  • Abstract
    Gate-all-around (GAA) sequential-lateral-solidification (SLS) nanowire (NW) thin-film transistor (TFT) devices with single-gate and dual-gate structures are fabricated and characterized. Compared with planar SLS TFT, owing to only one perpendicular grain boundary in each NW channel, GAA SLS NW TFT with single-gate structure can exhibit better performances when operated at low gate/drain voltage. However, it suffers from an obvious kink effect when operated at high gate/drain voltage because of the local electrical fields located at the sharp corners in GAA structure. Via dual-gate structure design, it clearly improves the performance of TFT device, which thus has a lower leakage current, a higher ON/OFF ratio, and an improved kink effect as compared with single-gate TFTs by avoiding the perpendicular grain boundaries and reducing electrical fields near channel/drain junction regions. In addition, the device reliability, such as the threshold voltage shift, subthreshold swing, and transconductance degradation under dc hot-carrier stress, is apparently improved by the proposed structure.
  • Keywords
    integrated circuit design; nanowires; solidification; thin film transistors; GAA SLS NW TFT; GAA sequential-lateral-solidification; SLS nanowire TFT; dual-gate structure design; gate-all-around sequential-lateral-solidification; nanowire thin-film transistor; single-gate structure; Dual-gate; electrical field; gate-all-around; hot-carrier stress; nanowire; reliability; sequential-lateral-solidification;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2261694
  • Filename
    6523144