DocumentCode :
87981
Title :
Electrical–Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems
Author :
Jianyong Xie ; Swaminathan, Madhavan
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
4
Issue :
4
fYear :
2014
fDate :
Apr-14
Firstpage :
588
Lastpage :
601
Abstract :
Because of the multiple scales in 3-D integrated systems, numerical simulation methods that are able to handle multiscale problems efficiently are strongly required. In this paper, electrical-thermal cosimulation of multiscale integrated systems using Mortar finite element-based domain decomposition method is proposed. Using the nonconformal domain decomposition approach, integrated systems can be divided into separate subdomains. Individual subdomains can be discretized independently based on its detailed feature size and formulated using the finite element method with associated boundary conditions. The coupling between domains is captured using Lagrange multipliers. For large multiscale 3-D problems, the cascadic multigrid method combined with the subspace confined preconditioned conjugate gradient method is used to accelerate the convergence of the solution with hierarchical meshing grids. Several examples are simulated and the results validate the accuracy and efficiency of the electrical-thermal cosimulation using nonconformal domain decomposition.
Keywords :
circuit simulation; conjugate gradient methods; differential equations; finite element analysis; thermal management (packaging); three-dimensional integrated circuits; Lagrange multipliers; Mortar finite element; cascadic multigrid method; electrical-thermal cosimulation; hierarchical meshing grids; multiscale 3D integrated systems; nonconformal domain decomposition method; subspace confined preconditioned conjugate gradient method; Boundary conditions; Equations; Finite element analysis; Mathematical model; Resistance heating; Thermal analysis; Cascadic multigrid (CMG) method; Joule heating; Lagrange multipliers; Mortar finite element method (FEM); domain decomposition; multiscale; preconditioned conjugate gradient (PCG) method; through-silicon via (TSV); voltage drop;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2013.2286403
Filename :
6658890
Link To Document :
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