• DocumentCode
    87981
  • Title

    Electrical–Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems

  • Author

    Jianyong Xie ; Swaminathan, Madhavan

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    4
  • Issue
    4
  • fYear
    2014
  • fDate
    Apr-14
  • Firstpage
    588
  • Lastpage
    601
  • Abstract
    Because of the multiple scales in 3-D integrated systems, numerical simulation methods that are able to handle multiscale problems efficiently are strongly required. In this paper, electrical-thermal cosimulation of multiscale integrated systems using Mortar finite element-based domain decomposition method is proposed. Using the nonconformal domain decomposition approach, integrated systems can be divided into separate subdomains. Individual subdomains can be discretized independently based on its detailed feature size and formulated using the finite element method with associated boundary conditions. The coupling between domains is captured using Lagrange multipliers. For large multiscale 3-D problems, the cascadic multigrid method combined with the subspace confined preconditioned conjugate gradient method is used to accelerate the convergence of the solution with hierarchical meshing grids. Several examples are simulated and the results validate the accuracy and efficiency of the electrical-thermal cosimulation using nonconformal domain decomposition.
  • Keywords
    circuit simulation; conjugate gradient methods; differential equations; finite element analysis; thermal management (packaging); three-dimensional integrated circuits; Lagrange multipliers; Mortar finite element; cascadic multigrid method; electrical-thermal cosimulation; hierarchical meshing grids; multiscale 3D integrated systems; nonconformal domain decomposition method; subspace confined preconditioned conjugate gradient method; Boundary conditions; Equations; Finite element analysis; Mathematical model; Resistance heating; Thermal analysis; Cascadic multigrid (CMG) method; Joule heating; Lagrange multipliers; Mortar finite element method (FEM); domain decomposition; multiscale; preconditioned conjugate gradient (PCG) method; through-silicon via (TSV); voltage drop;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2286403
  • Filename
    6658890