DocumentCode
87981
Title
Electrical–Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems
Author
Jianyong Xie ; Swaminathan, Madhavan
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
4
Issue
4
fYear
2014
fDate
Apr-14
Firstpage
588
Lastpage
601
Abstract
Because of the multiple scales in 3-D integrated systems, numerical simulation methods that are able to handle multiscale problems efficiently are strongly required. In this paper, electrical-thermal cosimulation of multiscale integrated systems using Mortar finite element-based domain decomposition method is proposed. Using the nonconformal domain decomposition approach, integrated systems can be divided into separate subdomains. Individual subdomains can be discretized independently based on its detailed feature size and formulated using the finite element method with associated boundary conditions. The coupling between domains is captured using Lagrange multipliers. For large multiscale 3-D problems, the cascadic multigrid method combined with the subspace confined preconditioned conjugate gradient method is used to accelerate the convergence of the solution with hierarchical meshing grids. Several examples are simulated and the results validate the accuracy and efficiency of the electrical-thermal cosimulation using nonconformal domain decomposition.
Keywords
circuit simulation; conjugate gradient methods; differential equations; finite element analysis; thermal management (packaging); three-dimensional integrated circuits; Lagrange multipliers; Mortar finite element; cascadic multigrid method; electrical-thermal cosimulation; hierarchical meshing grids; multiscale 3D integrated systems; nonconformal domain decomposition method; subspace confined preconditioned conjugate gradient method; Boundary conditions; Equations; Finite element analysis; Mathematical model; Resistance heating; Thermal analysis; Cascadic multigrid (CMG) method; Joule heating; Lagrange multipliers; Mortar finite element method (FEM); domain decomposition; multiscale; preconditioned conjugate gradient (PCG) method; through-silicon via (TSV); voltage drop;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2013.2286403
Filename
6658890
Link To Document