DocumentCode
880545
Title
Some reliability problems of surface-mounted devices
Author
Muto, Tokio
Author_Institution
Tokyo Denki Univ., Japan
Volume
4
Issue
4
fYear
1988
fDate
7/1/1988 12:00:00 AM
Firstpage
9
Lastpage
13
Abstract
The general characteristics of suitable SMT (surface mount technology) substrates are outlined, and various substrate materials are considered. Adhesion between devices and substrates is discussed. In particular, the effects of cycle strains and stresses, problems related to solder and contact metals, and electromigration problems are examined.<>
Keywords
adhesion; circuit reliability; deformation; electromigration; soldering; stress effects; substrates; surface mount technology; SMT; adhesion; contact metals; cycle strains; electromigration problems; packaging; reliability; solder; stresses; substrate materials; surface-mounted devices; Assembly; Ceramics; Conducting materials; Electronic equipment; Inorganic materials; Power dissipation; Substrates; Surface-mount technology; Thermal conductivity; Thermal resistance;
fLanguage
English
Journal_Title
Circuits and Devices Magazine, IEEE
Publisher
ieee
ISSN
8755-3996
Type
jour
DOI
10.1109/101.20777
Filename
20777
Link To Document