Testing the robustness of two-boundary control policies in semiconductor manufacturing

Author

Yan, Houmin ; Lou, Sheldon ; Sethi, Suresh ; Gardel, Anne ; Deosthali, Prabhat

Author_Institution

Dept. of Syst. Eng. & Eng. Manage., Chinese Univ. of Hong Kong, Shatin, Hong Kong

Volume

9

Issue

2

fYear

1996

fDate

5/1/1996 12:00:00 AM

Firstpage

285

Lastpage

288

Abstract

A simulation model based on a real wafer fabrication is used to investigate the robustness of the two-boundary (TB) production control strategy to the existing uniform loading policy used in a semiconductor fab. Our findings confirm that the TB policy is the most robust of all when random interference, such as machine breakdowns and demand variations, exist. It is also observed that the performance of the wafer fabrication facility under investigation can be improved significantly in terms of reducing cycle time, decreasing work-in-progress (WIP), and cutting down inventory cost

Keywords

production control; robust control; semiconductor device manufacture; semiconductor process modelling; cycle time; demand variation; inventory cost; loading policy; machine breakdown; random interference; robustness; semiconductor manufacturing; simulation model; two-boundary production control; wafer fabrication; work-in-progress; Electric breakdown; Fluctuations; Production control; Production systems; Robust control; Robustness; Semiconductor device manufacture; Semiconductor device modeling; Semiconductor device testing; System performance;

fLanguage

English

Journal_Title

Semiconductor Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

0894-6507

Type

jour

DOI

10.1109/66.492825

Filename

492825