DocumentCode :
880832
Title :
Testing the robustness of two-boundary control policies in semiconductor manufacturing
Author :
Yan, Houmin ; Lou, Sheldon ; Sethi, Suresh ; Gardel, Anne ; Deosthali, Prabhat
Author_Institution :
Dept. of Syst. Eng. & Eng. Manage., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Volume :
9
Issue :
2
fYear :
1996
fDate :
5/1/1996 12:00:00 AM
Firstpage :
285
Lastpage :
288
Abstract :
A simulation model based on a real wafer fabrication is used to investigate the robustness of the two-boundary (TB) production control strategy to the existing uniform loading policy used in a semiconductor fab. Our findings confirm that the TB policy is the most robust of all when random interference, such as machine breakdowns and demand variations, exist. It is also observed that the performance of the wafer fabrication facility under investigation can be improved significantly in terms of reducing cycle time, decreasing work-in-progress (WIP), and cutting down inventory cost
Keywords :
production control; robust control; semiconductor device manufacture; semiconductor process modelling; cycle time; demand variation; inventory cost; loading policy; machine breakdown; random interference; robustness; semiconductor manufacturing; simulation model; two-boundary production control; wafer fabrication; work-in-progress; Electric breakdown; Fluctuations; Production control; Production systems; Robust control; Robustness; Semiconductor device manufacture; Semiconductor device modeling; Semiconductor device testing; System performance;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.492825
Filename :
492825
Link To Document :
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