Characteristics of aligned carbon nanofibers for interconnect via applications

Author

Ngo, Quoc ; Cassell, Alan M. ; Austin, Alexander J. ; Li, Jun ; Krishnan, Shoba ; Meyyappan, M. ; Yang, Cary Y.

Author_Institution

Center for Nanostruct., Santa Clara Univ., Moffet Field, CA, USA

Volume

27

Issue

4

fYear

2006

fDate

4/1/2006 12:00:00 AM

Firstpage

221

Lastpage

224

Abstract

Electrical properties of plasma-enhanced chemical vapor deposited carbon nanofibers (CNFs) are characterized with measurements over a broad temperature range (4-300 K). Temperature-dependent measurements of CNF via resistivity reveal a behavior resembling the mixture of graphite a-axis and c-axis transport mechanisms. For the first time, temperature-dependent characteristics of CNFs are measured and modeled based on previously developed models for electron conduction in graphite. Reliability measurements are performed to demonstrate the robust electrical and thermal properties of CNF vias for next-generation on-chip-interconnect designs.

Keywords

carbon fibres; electrical conductivity; fullerenes; graphite; nanostructured materials; plasma CVD coatings; reliability; 4 to 300 K; carbon nanofibers; electrical properties; electron conduction; graphite a-axis transport mechanism; graphite c-axis transport mechanism; on-chip-interconnect design; plasma-enhanced chemical vapor deposition; reliability measurements; thermal properties; Chemicals; Electric variables measurement; Mechanical factors; Plasma applications; Plasma chemistry; Plasma measurements; Plasma properties; Plasma temperature; Plasma transport processes; Temperature distribution; Carbon nanofiber (CNF); interconnect; via;

fLanguage

English

Journal_Title

Electron Device Letters, IEEE

Publisher

ieee

ISSN

0741-3106

Type

jour

DOI

10.1109/LED.2006.870865

Filename

1610767