• DocumentCode
    881923
  • Title

    Influence of oxygen diffusion through capping layers of low work function metal gate electrodes

  • Author

    Chen, Bei ; Jha, Rashmi ; Lazar, Heather ; Biswas, Nivedita ; Lee, Jaehoon ; Lee, Bongmook ; Wielunski, Leszek ; Garfunkel, Eric ; Misra, Veena

  • Author_Institution
    Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
  • Volume
    27
  • Issue
    4
  • fYear
    2006
  • fDate
    4/1/2006 12:00:00 AM
  • Firstpage
    228
  • Lastpage
    230
  • Abstract
    This letter evaluates Ru and W capping layers for MoTa metal gate electrodes in MOS capacitor applications. The authors report that the oxygen diffusion from the capping layer plays an important role in determining the MoTa alloy effective work function value on SiO2. A MoTa alloy metal gate with Ru capping exhibits stable effective work function up to 900°C annealing but is not stable with W capping. Auger electron spectroscopy and Rutherford backscattering spectroscopy analyses show minimal oxygen diffusion into MoTa gate stacks with Ru capping while severe oxygen diffusion into the gate is observed with W capping metal after 900°C annealing. Current-voltage analysis also demonstrates different barrier heights of MoTa on SiO2 with Ru or W capping layer after 900°C annealing, confirming the effective work function value change.
  • Keywords
    Auger electron spectroscopy; MOS capacitors; Rutherford backscattering; annealing; dielectric materials; diffusion; electrodes; molybdenum alloys; oxygen; ruthenium; silicon compounds; tantalum alloys; tungsten; work function; Auger electron spectroscopy; MOS capacitor; MoTa; Ru; Rutherford backscattering spectroscopy; SiO2; W; capping layers; current-voltage analysis; effective work function; metal gate electrodes; oxygen diffusion; Annealing; Backscatter; Dielectrics; Electrodes; Electrons; Oxygen; Spectroscopy; Sputtering; Thermal stability; Threshold voltage; Alloy; MoTa; capping; effective work function; metal gate; oxygen diffusion;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2006.871184
  • Filename
    1610769