DocumentCode :
883494
Title :
Simulating single-event burnout of n-channel power MOSFET´s
Author :
Johnson, Gregory H. ; Hohl, Jakob H. ; Schrimpf, Ronald D. ; Galloway, Kenneth F.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Volume :
40
Issue :
5
fYear :
1993
fDate :
5/1/1993 12:00:00 AM
Firstpage :
1001
Lastpage :
1008
Abstract :
Single-event burnout of power MOSFETs is a sudden catastrophic failure mechanism that is initiated by the passage of a heavy ion through the device structure. The passage of the heavy ion generates a current filament that locally turns on a parasitic n-p-n transistor inherent to the power MOSFET. Subsequent high currents and high voltage in the device induce second breakdown of the parasitic bipolar transistor and hence meltdown of the device. This paper presents a model that can be used for simulating the burnout mechanism in order to gain insight into the significant device parameters that most influence the single-event burnout susceptibility of n-channel power MOSFETs
Keywords :
impact ionisation; insulated gate field effect transistors; ion beam effects; power transistors; semiconductor device models; transients; DMOS cell; avalanche multiplication factor; catastrophic failure mechanism; current filament; heavy ion passage; high currents; high voltage; meltdown; model; n-channel power MOSFETs; parasitic n-p-n transistor; second breakdown; single-event burnout; Bipolar transistors; Breakdown voltage; Current density; Electrons; Failure analysis; Feedback; MOSFET circuits; Plugs; Power generation; Switches;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.210211
Filename :
210211
Link To Document :
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