Title :
Integrated-circuit thermal modeling
Author :
Castello, Rinaldo ; Antognetti, Paolo
fDate :
6/1/1978 12:00:00 AM
Abstract :
The static heat-flow problem has been solved analytically in three dimensions for a two-blocks structure. The computer program calculating the temperature maps is simple and fast. Examples are given of temperature profiles on the chip surface of a high-power IC.
Keywords :
Monolithic integrated circuits; Semiconductor device models; monolithic integrated circuits; semiconductor device models; Copper; Heat sinks; Integrated circuit modeling; Power amplifiers; Power integrated circuits; Silicon; Temperature distribution; Thermal conductivity; Thermal factors; Voltage;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.1978.1051054
