Fine pitch wire bonding development using a new multipurpose, multipad pitch test die

Author

Shu, Bill

Author_Institution

VLSI Technol. Inc., San Jose, CA, USA

Volume

14

Issue

4

fYear

1991

fDate

12/1/1991 12:00:00 AM

Firstpage

680

Lastpage

690

Abstract

A multipurpose, multipad pitch test die with pad pitches ranging from 5 mil down to 3 mil, suitable for evaluating gold-ball bonding, aluminum wedge bonding, tape automated bonding (TAB), array bonding, wafer probes, and molding operations is discussed. The author reviews the design features of this test die and presents the statistical design of the experiment strategy taken in developing a wire bond process for very fine pitch assembly based on this test die. The effect of major bonding parameters on bond ball shear force is discussed. A statistical method for predicting the ball shorting rate is compared with assembly yield data

Keywords

integrated circuit technology; lead bonding; packaging; tape automated bonding; 5 to 3 mil; Al wedge bonding; Au ball bonding; TAB; array bonding; ball shorting rate; bond ball shear force; design features; fine pitch wire bonding; molding operations; multipad pitch test die; response surface methodology; shear force; statistical design; tape automated bonding; very fine pitch assembly; wafer probes; Aluminum; Assembly; Automatic testing; Bonding forces; Costs; Plastic packaging; Semiconductor device packaging; Very large scale integration; Wafer bonding; Wire;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.105117

Filename

105117