Title :
Composite solders
Author :
Marshall, James L. ; Calderon, Jose ; Sees, Jennifer ; Lucey, George ; Hwang, Jennie S.
Author_Institution :
Center for Mater. Characterization, North Texas Univ., Denton, TX, USA
fDate :
12/1/1991 12:00:00 AM
Abstract :
The characterization of composite solders has been performed, specifically on tin/lead/Cu6Sn5 composition. This characterization includes both microstructural and mechanical analysis. Scanning electron microscope (SEM) characterization of cross sections of the composite solder was preferred over optical inspection, owing to the similar appearance of the Sn and Cu6Sn5 phases by the latter method. The mechanical properties of composites were examined and were found to be superior those of standard tin/lead solder. Melting points of composite solder were the same as 60/40 tin/lead solder. Solder joints were readily prepared using the composite solder and were forced to failure by thermocyclic fatigue. The mechanism of failure was the same as for 60/40 Sn/Pb solder, i.e. heterogeneous coarsening. Auger/ESCA analysis of the intermetallic was performed to ascertain the nature of the surface of this filler, and it was found to be enriched in tin
Keywords :
Auger effect; copper alloys; creep; lead alloys; scanning electron microscope examination of materials; soldering; spectrochemical analysis; tensile strength; thermal stress cracking; tin alloys; Auger analysis; ESCA analysis; SEM; Sn-Pb-Cu6Sn5; composite solders; creep; cross sections; failure mechanism; heterogeneous coarsening; mechanical analysis; melting points; microstructure; solder joints; tensile strength; thermocyclic fatigue; Electron optics; Fatigue; Inspection; Lead; Mechanical factors; Optical microscopy; Performance analysis; Scanning electron microscopy; Soldering; Tin;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
