Improved thermal conductivity in microelectronic encapsulants

Author

Procter, Philip ; Solc, Jitka

Author_Institution

Dexter Electron. Mater., Olean, NY, USA

Volume

14

Issue

4

fYear

1991

fDate

12/1/1991 12:00:00 AM

Firstpage

708

Lastpage

713

Abstract

Several thermally conductive ceramics in combination with different polymer matrices have been examined. The interdependence of thermal conductivity with other key properties of the polymer composites are discussed. Selection of the filler and the resultant filler content in semiconductor grade molding compound are discussed in view of the practical limitations of composite thermal conductivity. Theoretical predictions of the Nielsen model (1973) are considered. The temperature dependence of composite thermal conductivity has been measured, and the effects of different types of polymer matrices are shown

Keywords

encapsulation; filled polymers; integrated circuit technology; thermal conductivity of solids; Nielsen model; filler content; microelectronic encapsulants; polymer matrices; semiconductor grade molding compound; temperature dependence; thermally conductive ceramics; Conducting materials; Conductivity measurement; Electronic packaging thermal management; Microelectronics; Polymers; Semiconductor device packaging; Silicon compounds; Temperature dependence; Thermal conductivity; Thermal management;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.105121

Filename

105121