• DocumentCode
    887513
  • Title

    Solder interconnections for SMT selective line coupling

  • Author

    Parla, Anthony ; Procopio, George ; Posivy, J. Kevin

  • Author_Institution
    IBM Gen. Technol. Div., Essex Junction, VT, USA
  • Volume
    14
  • Issue
    4
  • fYear
    1991
  • fDate
    12/1/1991 12:00:00 AM
  • Firstpage
    738
  • Lastpage
    743
  • Abstract
    An attempt to decrease the turnaround time on printed circuit (PC) card design and procurement is discussed. Solder interconnection is a technology designed to reduce the number of card designs. It is beneficial to applications requiring multiplex signal lines and is produced by unique solder mask designs and personalized by use of the surface mount technology (SMT) process. The masks are designed in conjunction with solder interconnects on card surfaces and, with assigned apertures, allow solder to be applied on selected connections. While solder interconnect allows flexibility, its design is critical in order to ensure high reliability, manufacturability, and proper electrical parameters. Hardware has been qualified, manufactured, and tested for these attributes in a SMT process
  • Keywords
    masks; printed circuit design; printed circuit manufacture; soldering; surface mount technology; SMT selective line coupling; electrical parameters; manufacturability; multiplex signal lines; printed circuit card design; reliability; solder interconnections; solder mask designs; surface mount technology; turnaround time; Apertures; Coupling circuits; Hardware; Integrated circuit interconnections; Manufacturing; Printed circuits; Procurement; Signal design; Signal processing; Surface-mount technology;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.105126
  • Filename
    105126