DocumentCode :
887513
Title :
Solder interconnections for SMT selective line coupling
Author :
Parla, Anthony ; Procopio, George ; Posivy, J. Kevin
Author_Institution :
IBM Gen. Technol. Div., Essex Junction, VT, USA
Volume :
14
Issue :
4
fYear :
1991
fDate :
12/1/1991 12:00:00 AM
Firstpage :
738
Lastpage :
743
Abstract :
An attempt to decrease the turnaround time on printed circuit (PC) card design and procurement is discussed. Solder interconnection is a technology designed to reduce the number of card designs. It is beneficial to applications requiring multiplex signal lines and is produced by unique solder mask designs and personalized by use of the surface mount technology (SMT) process. The masks are designed in conjunction with solder interconnects on card surfaces and, with assigned apertures, allow solder to be applied on selected connections. While solder interconnect allows flexibility, its design is critical in order to ensure high reliability, manufacturability, and proper electrical parameters. Hardware has been qualified, manufactured, and tested for these attributes in a SMT process
Keywords :
masks; printed circuit design; printed circuit manufacture; soldering; surface mount technology; SMT selective line coupling; electrical parameters; manufacturability; multiplex signal lines; printed circuit card design; reliability; solder interconnections; solder mask designs; surface mount technology; turnaround time; Apertures; Coupling circuits; Hardware; Integrated circuit interconnections; Manufacturing; Printed circuits; Procurement; Signal design; Signal processing; Surface-mount technology;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/33.105126
Filename :
105126
Link To Document :
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