Title :
3-D electromagnetic field analysis of interconnections in copper-polyimide multichip modules
Author :
Sasaki, Shinichi ; Konno, Riyo ; Tomimuro, Hisashi ; Ohsaki, Takaaki
Author_Institution :
NTT Corp., Tokyo, Japan
fDate :
12/1/1991 12:00:00 AM
Abstract :
A three-dimensional electromagnetic field analysis of interconnections in copper-polyimide multichip modules is described. This analysis is based on the spatial network method: a lattice network model of Maxwell´s equation formulated in the time domain by Bergeron´s method. Results of simulating reflection and transmission waves at interconnections are presented. Frequency characteristics of the scattering parameter S21 are calculated using the fast Fourier transform (FFT). The 3-dB down cutoff frequencies of wire bonded, tape automated bonding (TAB), and flip-chip bonding (FCB) interconnections are, respectively, 6, 14, and 40 GHz; those of interconnection vias are over 200 GHz. Copper-polyimide multichip modules can, therefore, be applied to ultra-high-speed systems
Keywords :
S-parameters; copper; electromagnetic fields; fast Fourier transforms; flip-chip devices; integrated circuit technology; modules; packaging; polymer films; tape automated bonding; 14 GHz; 40 GHz; 6 GHz; Bergeron´s method; Cu; Maxwell´s equation; TAB; copper-polyimide multichip modules; cutoff frequencies; fast Fourier transform; flip-chip bonding; interconnection vias; interconnections; lattice network model; reflection waves; scattering parameter frequency characteristics; spatial network method; three-dimensional electromagnetic field analysis; time domain formulation; transmission waves; ultra-high-speed systems; wire bonding; Bonding; Electromagnetic analysis; Electromagnetic fields; Electromagnetic reflection; Frequency; Lattices; Maxwell equations; Multichip modules; Scattering parameters; Time domain analysis;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
