Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications

Author

Choi, Jinwoo ; Dong Gun Kam ; Chung, Daehyun ; Srinivasan, Krishna ; Govind, Vinu ; Kim, Joungho ; Swaminathan, Madhavan

Author_Institution

IBM Syst. & Technol. Group, IBM Corp., Austin, TX

Volume

30

Issue

2

fYear

2007

fDate

5/1/2007 12:00:00 AM

Firstpage

180

Lastpage

190

Abstract

This paper presents near-field (NF) and far-field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in packages and boards. Three test vehicles have been designed and fabricated for NF and FF measurements. Simulation results using a full-wave solver (SONNET) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure based power distribution network for noise isolation and suppression in mixed-signal systems

Keywords

electromagnetic interference; integrated circuit interconnections; mixed analog-digital integrated circuits; photonic band gap; SONNET; alternating impedance electromagnetic bandgap structure; electromagnetic interference; far-field analyses; full-wave solver; mixed-signal applications; near-field analyses; noise isolation; noise suppression; power distribution network; signal integrity; Analytical models; Electromagnetic analysis; Electromagnetic measurements; Impedance; Noise measurement; Packaging; Periodic structures; Power measurement; Testing; Vehicles; Alternating impedance electromagnetic bandgap (AI-EBG) structure; electromagnetic interference (EMI); far-field (FF); mixed-signal system; near-field (NF); noise isolation; radiation; signal integrity;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2007.896921

Filename

4214895