Combination of numerical and experimental methods for stress analysis of small electronic components

Author

Villain, Jürgen ; Borner, Hartwig

Author_Institution

Siemens Nixdorf Informationssyst. AG, Munich, Germany

Volume

14

Issue

4

fYear

1991

fDate

12/1/1991 12:00:00 AM

Firstpage

766

Lastpage

770

Abstract

Examples of the development of a multichip module with extremely loaded components are presented. It is shown that a reasonable combination of experimental methods, e.g. holographic interferometry, metallography, and a good knowledge of the specific material behavior under working conditions result in better numerical simulation under realistic boundary conditions. This allows shape and material optimization during the development phase to achieve components with high reliability in a short development time

Keywords

holographic interferometry; integrated circuit technology; metallography; modules; numerical analysis; packaging; stress analysis; LSI packaging; boundary conditions; high reliability; holographic interferometry; material optimization; metallography; multichip module; numerical simulation; plated through blind holes; small electronic components; stress analysis; Boundary conditions; Employee welfare; Holography; Inorganic materials; Interferometry; Materials reliability; Multichip modules; Numerical simulation; Shape; Stress;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.105131

Filename

105131