DocumentCode :
888082
Title :
Surface Current Modelling of the Skin Effect for On-Chip Interconnections
Author :
De Zutter, Daniël ; Rogier, Hendrik ; Knockaert, Luc ; Sercu, Jeannick
Author_Institution :
Ghent Univ., Ghent
Volume :
30
Issue :
2
fYear :
2007
fDate :
5/1/2007 12:00:00 AM
Firstpage :
342
Lastpage :
349
Abstract :
In this paper, the skin effect for 2-D on-chip interconnections is predicted using a recently developed differential surface admittance concept. First, the features of the new approach are briefly recapitulated and details are given for a conductor with rectangular cross-section. Next, the 1-D situation is studied as a limiting case of the 2-D situation. The relationship with a local impedance formulation is investigated and illustrated with a numerical example. Finally, the new method is used to determine inductance and resistance matrices of 2-D on-chip interconnect examples with specifications taken from the international technology roadmap for semiconductors. Extra capacitance data are also provided.
Keywords :
electric admittance; integrated circuit interconnections; matrix algebra; skin effect; 2D on-chip interconnections; International Technology Roadmap for Semiconductors; differential surface admittance; inductance matrices; resistance matrices; skin effect; surface current modelling; Admittance; Capacitance; Clocks; Conducting materials; Conductors; Frequency; Inductance; Skin effect; Surface impedance; Surface resistance; On-chip interconnect; resistance and inductance matrices; skin effect; surface impedance/admittane;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2007.895984
Filename :
4214903
Link To Document :
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