• DocumentCode
    888082
  • Title

    Surface Current Modelling of the Skin Effect for On-Chip Interconnections

  • Author

    De Zutter, Daniël ; Rogier, Hendrik ; Knockaert, Luc ; Sercu, Jeannick

  • Author_Institution
    Ghent Univ., Ghent
  • Volume
    30
  • Issue
    2
  • fYear
    2007
  • fDate
    5/1/2007 12:00:00 AM
  • Firstpage
    342
  • Lastpage
    349
  • Abstract
    In this paper, the skin effect for 2-D on-chip interconnections is predicted using a recently developed differential surface admittance concept. First, the features of the new approach are briefly recapitulated and details are given for a conductor with rectangular cross-section. Next, the 1-D situation is studied as a limiting case of the 2-D situation. The relationship with a local impedance formulation is investigated and illustrated with a numerical example. Finally, the new method is used to determine inductance and resistance matrices of 2-D on-chip interconnect examples with specifications taken from the international technology roadmap for semiconductors. Extra capacitance data are also provided.
  • Keywords
    electric admittance; integrated circuit interconnections; matrix algebra; skin effect; 2D on-chip interconnections; International Technology Roadmap for Semiconductors; differential surface admittance; inductance matrices; resistance matrices; skin effect; surface current modelling; Admittance; Capacitance; Clocks; Conducting materials; Conductors; Frequency; Inductance; Skin effect; Surface impedance; Surface resistance; On-chip interconnect; resistance and inductance matrices; skin effect; surface impedance/admittane;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2007.895984
  • Filename
    4214903