DocumentCode
888091
Title
Foreword Topical Special Issue on the Electrical Performance of Packages and Interconnects
Author
Schutt-Ainé, José E.
Volume
30
Issue
2
fYear
2007
fDate
5/1/2007 12:00:00 AM
Firstpage
162
Lastpage
162
Abstract
The twenty articles in this special issue focus on the electrical performance of packages and interconnects. The papers can be divided into three sections: package design and noise; macromodeling; and electromagnetic analysis.
Keywords
Application software; Communication networks; Computer networks; Design methodology; Digital integrated circuits; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Radio frequency; Signal design;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2007.900164
Filename
4214904
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