DocumentCode
888190
Title
Design, Implementation, and Testing of Miniaturized Electromagnetic Bandgap Structures for Broadband Switching Noise Mitigation in High-Speed PCBs
Author
Shahparnia, Shahrooz ; Ramahi, Omar M.
Author_Institution
Electr. & Comput. Eng. Dept., Maryland Univ., College Park, MD
Volume
30
Issue
2
fYear
2007
fDate
5/1/2007 12:00:00 AM
Firstpage
171
Lastpage
179
Abstract
In recent years, advances in CMOS technology, resulted in devices with higher switching speeds, lower power supply voltages, and higher package densities. Lowering the power supply voltages and hence the power consumption of a single transistor, has been possible due to the fact that these new technologies are able to provide smaller and faster transistors with lower threshold levels. The benefits associated with lowering the threshold levels of the transistors used in a given device comes at a high-price, specifically the decrease of immunity of such device to noise and fluctuations of the power supply voltages. This paper covers the concept of embedding electromagnetic bandgap (EBG) structures in conventional power distribution networks in order to increase the immunity of the circuits that feed from such networks to noise and voltage fluctuations. Underlying theories of embedded EBG (EEBG) structures and design methodologies are presented. Finally, in order to provide immunity to high-bandwidth noise, voltage fluctuations and radiation, new EEBG configurations, topologies and miniaturized structures with ultra wide-bandwidth are introduced and their efficacy is demonstrated
Keywords
CMOS integrated circuits; electronics packaging; integrated circuit interconnections; integrated circuit noise; photonic band gap; printed circuit design; CMOS technology; broadband switching noise mitigation; conventional power distribution networks; electromagnetic noise; electronic packages; high-impedance surfaces; high-speed PCB; miniaturized electromagnetic bandgap structures; noise fluctuations; printed-circuit boards; voltage fluctuations; CMOS technology; Circuit noise; Electromagnetic interference; Metamaterials; Packaging; Periodic structures; Power supplies; Testing; Threshold voltage; Voltage fluctuations; Electromagnetic bandgap structures; electromagnetic noise; electronic packages; high-impedance surfaces; printed-circuit boards (PCBs); switching noise;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2007.895612
Filename
4214915
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