A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

Author

Colgan, Evan G. ; Furman, Bruce ; Gaynes, Michael ; Graham, Willian S. ; LaBianca, Nancy C. ; Magerlein, John H. ; Polastre, Robert J. ; Rothwell, Mary Beth ; Bezama, R.J. ; Choudhary, Rehan ; Marston, Kenneth C. ; Toy, Hilton ; Wakil, Jamil ; Zitz, Jeffr

Author_Institution

IBM T. J. Watson Res. Center, Yorktown Heights, NY

Volume

30

Issue

2

fYear

2007

fDate

6/1/2007 12:00:00 AM

Firstpage

218

Lastpage

225

Abstract

This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm²/W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300W/cm². Coolers of this design should be able to cool chips with average power densities of 400W/cm² or more

Keywords

cooling; heat exchangers; microchannel flow; silicon; thermal management (packaging); high power chips; high power density; liquid cooling; microprocessors; multiple heat exchanger zones; optimized cooler fin designs; silicon microchannel cooling; thermal test chip; Cooling; Design optimization; Microchannel; Microprocessors; Resistance heating; Silicon; Surface resistance; Testing; Thermal resistance; Water heating; High power density; liquid cooling; microchannel cooling;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2007.897977

Filename

4214931