DocumentCode
888377
Title
Foreword Contributions From SEMI-THERM 21
Author
Parry, John D.
Volume
30
Issue
2
fYear
2007
fDate
6/1/2007 12:00:00 AM
Firstpage
199
Lastpage
199
Abstract
The five papers in this special section are drawn from different oral sessions at SEMI-THERM 21 that reflect the current challenges faced by the industry in microscale liquid cooling, thermal interface material development, interface resistance minimization, and stacked die.
Keywords
Bonding; Electrical resistance measurement; Liquid cooling; Microchannel; Moore´s Law; Packaging; Silicon; Temperature measurement; Testing; Thermal resistance;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2007.898495
Filename
4214936
Link To Document