• DocumentCode
    888419
  • Title

    Rudimentary Finite Element Thermal Modeling of Platelet-Filled Polymer-Ceramic Composites

  • Author

    Hill, Richard F. ; Strader, Jason L.

  • Author_Institution
    Laird Technol. Inc., Cleveland
  • Volume
    30
  • Issue
    2
  • fYear
    2007
  • fDate
    6/1/2007 12:00:00 AM
  • Firstpage
    235
  • Lastpage
    241
  • Abstract
    In order to improve the thermal performance of polymeric materials, they can be filled with intrinsically high thermal conductivity fillers that provide heat-conducting paths through the resulting composite. The thermal performance of polymers loaded with platelet-shaped fillers was modeled using finite element analysis in order to provide a prediction of thermal conductivity as a function of variables such as filler thermal conductivity, orientation, and polymer matrix thermal conductivity. Modeling results were compared to experimental data. An unexpectedly strong effect that the matrix conductivity has on the conductivity of the polymer-ceramic composite was predicted by modeling and confirmed experimentally.
  • Keywords
    filled polymers; finite element analysis; integrated circuit packaging; thermal conductivity; thermal management (packaging); heat-conducting paths; platelet-filled polymer-ceramic composites; platelet-shaped fillers; polymer matrix thermal conductivity; polymers thermal performance; rudimentary finite element thermal modeling; thermal conductivity fillers; Conducting materials; Electronic packaging thermal management; Finite element methods; Polymer films; Predictive models; Temperature; Thermal conductivity; Thermal factors; Thermal loading; Thermal resistance; Composites; finite element (FE) modeling; platelets; polymers; thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2007.898330
  • Filename
    4214941