DocumentCode
888419
Title
Rudimentary Finite Element Thermal Modeling of Platelet-Filled Polymer-Ceramic Composites
Author
Hill, Richard F. ; Strader, Jason L.
Author_Institution
Laird Technol. Inc., Cleveland
Volume
30
Issue
2
fYear
2007
fDate
6/1/2007 12:00:00 AM
Firstpage
235
Lastpage
241
Abstract
In order to improve the thermal performance of polymeric materials, they can be filled with intrinsically high thermal conductivity fillers that provide heat-conducting paths through the resulting composite. The thermal performance of polymers loaded with platelet-shaped fillers was modeled using finite element analysis in order to provide a prediction of thermal conductivity as a function of variables such as filler thermal conductivity, orientation, and polymer matrix thermal conductivity. Modeling results were compared to experimental data. An unexpectedly strong effect that the matrix conductivity has on the conductivity of the polymer-ceramic composite was predicted by modeling and confirmed experimentally.
Keywords
filled polymers; finite element analysis; integrated circuit packaging; thermal conductivity; thermal management (packaging); heat-conducting paths; platelet-filled polymer-ceramic composites; platelet-shaped fillers; polymer matrix thermal conductivity; polymers thermal performance; rudimentary finite element thermal modeling; thermal conductivity fillers; Conducting materials; Electronic packaging thermal management; Finite element methods; Polymer films; Predictive models; Temperature; Thermal conductivity; Thermal factors; Thermal loading; Thermal resistance; Composites; finite element (FE) modeling; platelets; polymers; thermal conductivity;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2007.898330
Filename
4214941
Link To Document