Corrections to "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process"

Author

Kay, Robert W. ; Stoyanov, Stoyan ; Glinski, Greg P. ; Bailey, Chris ; Desmulliez, Marc P Y

Volume

Issue

fYear

2007

fDate

6/1/2007 12:00:00 AM

Firstpage

359

Lastpage

359

Keywords

Assembly; Biographies; Costs; Design optimization; Microelectronics; Numerical models; Packaging; Printing; Product design; Temperature;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

DOI

10.1109/TCAPT.2007.895649

Filename

4214943

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