• DocumentCode
    888671
  • Title

    Distributed Loss-Compensation Techniques for Energy-Efficient Low-Latency On-Chip Communication

  • Author

    Jose, Anup P. ; Shepard, Kenneth L.

  • Author_Institution
    Dept. of Electr. Eng., Columbia Univ., New York, NY
  • Volume
    42
  • Issue
    6
  • fYear
    2007
  • fDate
    6/1/2007 12:00:00 AM
  • Firstpage
    1415
  • Lastpage
    1424
  • Abstract
    In this paper, we describe the use of distributed loss compensation to provide nearly transmission-line behavior for long on-chip interconnects. Negative impedance converters (NICs) inserted at regular intervals along an on-chip line are shown to reduce losses from more than 1 dB/mm to less than 0.3 dB/mm at 10 GHz. Results are presented for a 14-mm 3-Gb/s on-chip double-data-rate (DDR) link in 0.18-mum CMOS technology, with a measured latency of 12.1 ps/mm and an energy consumption of less than 2 pJ/b with a BER<10-14. This constitutes a factor-of-three improvement in power and a one-and-a-half-times improvement in latency over an optimally repeated RC line of the same wire width
  • Keywords
    CMOS integrated circuits; integrated circuit interconnections; negative impedance convertors; transmission lines; 0.18 micron; 3 Gbit/s; 4 mm; BER; CMOS technology; distributed loss-compensation techniques; low-latency on-chip communication; negative impedance converters; on-chip double-data-rate; on-chip interconnects; transmission-line behavior; CMOS technology; Degradation; Delay; Energy efficiency; Impedance; Integrated circuit interconnections; Propagation losses; Repeaters; Transmission lines; Wire; Interconnections; on-chip networks; transmission lines;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.2007.897165
  • Filename
    4214970