The role of plastic package adhesion in performance

Author

Kim, Samuel

Author_Institution

Rohm & Haas Res. Lab., Spring House, PA, USA

Volume

14

Issue

4

fYear

1991

fDate

12/1/1991 12:00:00 AM

Firstpage

809

Lastpage

817

Abstract

The relationship between plastic package adhesion and semiconductor device performance is discussed. It is a general belief that better adhesion between the encapsulant, leadframe, and the silicon chip will result in improved reliability, resistance to package cracking, and reduced line movement due to thermal stresses. Adhesion is investigated from the viewpoints of thermodynamics, rheology, and processing conditions. The relationship between adhesion characteristics and copper oxide morphological structures and copper chemical treatments is investigated. Various adhesion test methods are evaluated, including conventional destructive tests and nondestructive scanning acoustic microscopy (SAM) analyses

Keywords

acoustic microscopy; adhesion; integrated circuit technology; packaging; reliability; thermal stress cracking; Cu chemical treatment; CuO morphological structures; adhesion test methods; cracking resistance; destructive tests; encapsulant; leadframe; line movement; nondestructive scanning acoustic microscopy; plastic package adhesion; processing conditions; reliability; rheology; semiconductor device performance; silicon chip; thermal stresses; thermodynamics; Acoustic testing; Adhesives; Copper; Nondestructive testing; Plastic packaging; Semiconductor device packaging; Semiconductor devices; Silicon; Thermal resistance; Thermal stresses;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.105138

Filename

105138