Thermal cycling induced plastic deformation in solder joints. II. Accumulated deformation in through hole joints

Author

Pan, Tsung-Yu

Author_Institution

Ford Motor Co., Dearborn, MI, USA

Volume

14

Issue

4

fYear

1991

fDate

12/1/1991 12:00:00 AM

Firstpage

824

Lastpage

832

Abstract

For pt.I see ASME Trans. J. Electron. Pack., vol.113, no.1, p.8-15 (March 1991). A thermal cycled pin-through-hole solder joint is modeled with finite element analysis using nonlinear elastic/plastic plus creep behavior. The large shift of the pins and the deformation of the solder are predicted with the model to be the result of the accumulated plastic deformation in the solder and the results correlated with experimental observations. Thermal cycling fatigue life predictions based on uniform shear, unchanged joint geometry, and the Coffin-Manson equation are found deficient for dealing with the complex deformation mechanism of pin-through-hole solder joint thermal fatigue

Keywords

creep fracture; elastoplasticity; finite element analysis; packaging; plastic deformation; printed circuit accessories; soldering; thermal stress cracking; Coffin-Manson equation; PWB interconnections; accumulated plastic deformation; creep behavior; finite element analysis; nonlinear elastic/plastic behaviour; pin-through-hole solder joint; solder joints; thermal cycling fatigue link; unchanged joint geometry; uniform shear; Creep; Deformable models; Electrons; Fatigue; Finite element methods; Geometry; Pins; Plastics; Predictive models; Soldering;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.105140

Filename

105140