Title :
Thermal cycling induced plastic deformation in solder joints. II. Accumulated deformation in through hole joints
Author_Institution :
Ford Motor Co., Dearborn, MI, USA
fDate :
12/1/1991 12:00:00 AM
Abstract :
For pt.I see ASME Trans. J. Electron. Pack., vol.113, no.1, p.8-15 (March 1991). A thermal cycled pin-through-hole solder joint is modeled with finite element analysis using nonlinear elastic/plastic plus creep behavior. The large shift of the pins and the deformation of the solder are predicted with the model to be the result of the accumulated plastic deformation in the solder and the results correlated with experimental observations. Thermal cycling fatigue life predictions based on uniform shear, unchanged joint geometry, and the Coffin-Manson equation are found deficient for dealing with the complex deformation mechanism of pin-through-hole solder joint thermal fatigue
Keywords :
creep fracture; elastoplasticity; finite element analysis; packaging; plastic deformation; printed circuit accessories; soldering; thermal stress cracking; Coffin-Manson equation; PWB interconnections; accumulated plastic deformation; creep behavior; finite element analysis; nonlinear elastic/plastic behaviour; pin-through-hole solder joint; solder joints; thermal cycling fatigue link; unchanged joint geometry; uniform shear; Creep; Deformable models; Electrons; Fatigue; Finite element methods; Geometry; Pins; Plastics; Predictive models; Soldering;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
