DocumentCode :
888943
Title :
Improving the radiation burn-out susceptibility of N-channel power MOSFETs
Author :
Keshavarz, Abdol A. ; Fischer, Thomas A.
Author_Institution :
Alliance Technologies Inc., Albuquerque, NM, USA
Volume :
39
Issue :
6
fYear :
1992
fDate :
12/1/1992 12:00:00 AM
Firstpage :
1943
Lastpage :
1946
Abstract :
Computer simulation was used to calculate the dose-rate thresholds of several different power MOSFET structures. Computational results indicate that significant improvements in radiation tolerance and burnout of the device are possible by reducing the lateral size of the power MOSFET unit cell or by using a lower emitter injection efficiency for the bipolar structure. Modification of some other factors, such as the base minority carrier lifetime or the epi/substrate interface shape, shows some minor improvements in device radiation tolerance
Keywords :
insulated gate field effect transistors; ion beam effects; power transistors; radiation hardening (electronics); semiconductor device models; N-channel power MOSFETs; base minority carrier lifetime; bipolar structure; computer simulation; dose-rate thresholds; epi/substrate interface shape; lateral size; lower emitter injection efficiency; radiation burn-out susceptibility; Charge carrier lifetime; Computational modeling; Computer simulation; Contracts; Ionizing radiation; Laboratories; MOSFETs; Radiation hardening; Shape; Voltage;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.211389
Filename :
211389
Link To Document :
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