Title :
Field dependent charge trapping effects in SIMOX and buried oxides at very high dose
Author :
Flament, O. ; Hervé, D. ; Musseau, O. ; Bonnel, Ph ; Raffaelli, M. ; Leray, J.L. ; Margail, J. ; Giffard, B. ; Auberton-Herve, A.J.
Author_Institution :
Centre d´´Etudes de Bruyeres, CEA, Bruyeres-Le-Chatel, France
fDate :
12/1/1992 12:00:00 AM
Abstract :
SIMOX (separation by implantation of oxygen) devices have been irradiated at up to 100 Mrad under different positive and negative back-gate voltages. At low cumulated dose, hole trapping is controlled by external applied field. For higher doses up to 100 Mrad, the early positive net charge is compensated mainly by electron trapping. Nevertheless, at weak fields, no evidence of positive charge compensation is observed. Interface state buildup appears at very high dose (>10 Mrad) for the set of biases used, but influences slightly Vtb shift. The trapped hole recombination effect also occurs, but seems significant only for negative biases in the numerical approach. Furthermore, annealing data reveal a complex structure of traps that requires further investigations
Keywords :
SIMOX; X-ray effects; electron traps; hole traps; insulated gate field effect transistors; interface electron states; metal-insulator-semiconductor devices; 100 Mrad; MOS capacitors; MOSI; SIMOX; Si-SiO2; X-ray irradiated; annealing; buried oxides; electron trapping; field dependent charge trapping; hole trapping; interface state buildup; trapped hole recombination effect; very high dose; Annealing; Charge carrier processes; Electron traps; Europe; High-speed electronics; MOSFETs; Spontaneous emission; Thickness control; Threshold voltage; Voltage control;
Journal_Title :
Nuclear Science, IEEE Transactions on